literature
Literature
Authors
Jobs
Seminars
Conferences
DataBETA

Overlay accuracy limitations of soft stamp UV nanoimprint lithography and circumvention strategies for device applications

Jun 13, 2018
4 pages
Published in:
  • Microelectron.Eng. 197 (2018) 83-86
  • Published: Jun 13, 2018
e-Print:
DOI:
View in:
pdf
reference search0 citations

Citations per year

0 Citations
Abstract: (Elsevier B.V.)
In this work multilevel pattering capabilities of Substrate Conformal Imprint Lithography (SCIL) have been explored. A mix & match approach combining the high throughput of nanoimprint lithography with the excellent overlay accuracy of electron beam lithography (EBL) has been exploited to fabricate nanoscale devices. An EBL system has also been utilized as a benchmarking tool to measure both stamp distortions and alignment precision of this mix & match approach. By aligning the EBL system to 20 mm × 20 mm and 8 mm × 8 mm cells to compensate pattern distortions of order of 3 μm over 6 in. wafer area, overlay accuracy better than 1.2 μm has been demonstrated. This result can partially be attributed to the flexible SCIL stamp which compensates deformations caused by the presence of particles which would otherwise significantly reduce the alignment precision.
  • Nanoimprint lithography
  • E-beam lithography
  • Overlay accuracy
  • Nanophotonics
  • [1]
    (80-.)
    • S.Y. Chou
      ,
    • P.R. Krauss
      ,
    • P.J. Renstrom
      • Science 272 (1996) 85-87
  • [2]
    • J. Haisma
      • J.Vac.Sci.Technol.B 14 (1996) 4124
  • [3]
    Y.Vladimirsky
    • M. Colburn
      ,
    • S.C. Johnson
      ,
    • M.D. Stewart
      ,
    • S. Damle
      ,
    • T.C. Bailey
    et al.
      • Proc.SPIE Int.Soc.Opt.Eng. (1999) 379
  • [4]
    • M. Verschuuren
  • [5]
    • R. Ji
      ,
    • M. Hornung
      ,
    • M.A. Verschuuren
      ,
    • R. van de Laar
      ,
    • J. van Eekelen
    et al.
      • Microelectron.Eng. 87 (2010) 963-967
  • [6]
    • R. Fader
      ,
    • M. Rommel
      ,
    • A. Bauer
      ,
    • M. Rumler
      ,
    • L. Frey
    et al.
      • J.Vac.Sci.Technol.B 31 (2013) 06FB02
  • [7]
    • J. Bolten
      ,
    • N. Koo
      ,
    • T. Wahlbrink
      ,
    • H. Kurz
      • Microelectron.Eng. 110 (2013) 224-228
  • [8]
    • J. Barnett
      ,
    • U. Plachetka
      ,
    • C. Nowak
      ,
    • H. Wackerbarth
      • Microelectron.Eng. 172 (2017) 45-48
  • [9]
    • R. Fader
      ,
    • M. Förthner
      ,
    • M. Rumler
      ,
    • M. Rommel
      ,
    • A.J. Bauer
    et al.
      • 13th Int. Conf. Nanoimprint Nanoimprint Technol., Kyoto, Japan (2014)
  • [10]
    • F. Qiu
      ,
    • A.M. Spring
      ,
    • D. Maeda
      ,
    • M. Ozawa
      ,
    • K. Odoi
    et al.
      • Sci.Rep. 5 (2015) 8561