Silicon pixel sensor R&D for the CLIC tracking detector

May 20, 2020
11 pages
Published in:
  • JINST 15 (2020) 08, C08005
Contribution to:
  • Published: Aug 5, 2020
e-Print:
Report number:
  • CLICdp-Conf-2020-005
Experiments:

Citations per year

202020212022421
Abstract: (arXiv)
The physics aims at the proposed high-energy e+ee^+e^- collider CLIC pose challenging demands on the performance of the detector system. Precise hit-time tagging, an excellent spatial resolutions, and a low mass are required for the vertex and tracking detectors. To meet these requirements, an all-silicon vertex and tracking detector system is foreseen, for which a broad R&D programme on a variety of novel silicon detector technologies is being pursued. For the ultra-low mass vertex detector, different hybrid technologies with innovative sensor concepts and interconnection techniques are explored. For the large-scale tracking detector, the focus of the R&D lies on monolithic HV-MAPS and HR-CMOS technologies. This contribution gives an overview of the ongoing activities with a focus on monolithic technologies for the CLIC tracking detector. Recent results from laboratory and test-beam measurement campaigns of the ATLASpix_Simple and the CLICTD sensor prototypes are presented.
  • activity report
  • semiconductor detector: technology
  • semiconductor detector: pixel
  • semiconductor detector: design
  • performance
  • tracking detector
  • CERN CLIC
  • vertex detector
  • hybrid
  • electronics: readout
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