Building pixel detector modules in multichip module deposited technology
2005
5 pages
Published in:
- IEEE Trans.Nucl.Sci. 52 (2005) 3176-3180
Experiments:
Citations per year
Abstract: (IEEE)
The MCM-D technique has been used to build hybrid pixel detector modules and single chip assemblies with optimized sensor geometry. Results of test measurements in both a laboratory and a test beam environment are given. Proton irradiation to the ATLAS pixel lifetime of a MCM-D single chip assembly has been carried out- Radiation detectors
- Multichip modules
- Proton radiation effects
- Semiconductor radiation detectors
- Detectors
- thin film technology
- ATLAS
- bump bonding
- flip chip
- pixel detectors
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