3D IC pixel electronics - the next challenge - INSPIRE

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3D IC pixel electronics - the next challenge

Oct, 2008

5 pages

Part of Electronics for particle physics. Proceedings, Topical Workshop, TWEPP-08, Naxos, Greece, 15-19 September 2008, 183-187

Contribution to:

- TWEPP08
, 183-187

Report number:

CERN-2008-008,
FERMILAB-PUB-08-422-E

reference search2 citations

Citations per year

talk: Naxos 2008/09/15
integrated circuit: design
integrated circuit: fabrication
electronics
semiconductor
performance
dimension: 3

References(9)

Figures(0)

[1]

Handbook of 3D Integration Technology and Applications of 3D Integrated circuits

P. Garrou

[2]

Laser Radar Imager Based on 3D Integration of Geiger Mode Avalanche Photodiodes with Two Timing Circuit Layers

B. Aull

[3]

3-D Integration Technology Platform for High Performance Detector Arrays

D. Temple

[4]

3D circuit integration for Vertex and other detectors

Ray Yarema
(
- Fermilab
)

- PoS VERTEX2007 (2008) 017
•
DOI:
- 10.22323/1.057.0017

[5]

Fabrication, Assembly, and Evaluation of Cu-Cu Bump Bond Arrays for Utra-fine Pitch Hybridization and 3D Assembly

A. Huffman

[6]

Development of 3D Integrated Circuits for HEP

R. Yarema

[7]

Characterization of Deep N-well CMOS MAPS with in Pixel Signal Processing and Data Sparsification Capabilities for the ILC Vertex Detector

G. Traversi

[8]

"Vertical Integration of Integrated Circuits and Pixel Detectors, Vertex, Jul 28-Aug. 1,, Uto Island, Sweden

G. Deptuch

[9]

3D Scaling to Production

B. Patti