3D design activities at Fermilab: Opportunities for physics

Fermilab began exploring the technologies for vertically integrated circuits (also commonly known as 3D circuits) in 2006. These technologies include through silicon vias (TSV), circuit thinning, and bonding techniques to replace conventional bump bonds. Since then, the interest within the High Energy Physics community has grown considerably. This paper will present an overview of the activities at Fermilab over the last 3 years which have helped spark this interest.

Vertical integration
3D integration

References(3)

Figures(0)

[1]

Fabrication, Assembly, and Evaluation of Cu-Cu Bump Bonding Arrays for Ultra-fine Pitch Hybridization and 3d Integration, Pixel Batavia Il, September

A. Huffman

[2]

3D circuit integration for Vertex and other detectors

Ray Yarema
(
- Fermilab
)

- PoS VERTEX2007 (2008) 017
•
DOI:
- 10.22323/1.057.0017

[3]

CMS Tracking Trigger Straw Men, CERN ACES Workshop, Feb

M. Mannelli