Monolithic Active Pixel Matrix with Binary Counters (MAMBO III) ASIC

Monolithic Active Matrix with Binary Counters (MAMBO) III 3D ASIC has been designed for detecting and measuring low energy X-rays from 6-12keV. The top ASIC consists of a matrix of 4444 pixels, each of

100\times 100 \mu{\rm m}^2

. Each pixel contains analogue functionality implemented with a charge preamplifier, CR-RC2 shaper and a baseline restorer. It also contains a window comparator with Upper and Lower thresholds which can be individually trimmed by 4 bit DACs to remove systematic offsets. The hits are registered by a 12 bit counter which is reconfigured as a shift register to serially output the data from the entire ASIC. The bottom ASIC contains gated diodes which can be controlled to improve pixel isolation and leakage current. It contains a small p-plus region with a large buried P-well (BPW), almost the same size as the pixel to obtain a parallel electric field in active volume and avoid potential pockets. It is also effectively shielded to electrically isolate the detector from the electronics. The T-Micro 3D integration process is used to bond the detector in the lower tier to the electronics in the upper tier. The ASICs have been manufactured by OKI, they are being 3D bonded at T-Micro.

semiconductor detector
electronics

References(3)

Figures(0)

[1]

Monolithic Pixel Detectors in deep submicron SOI process

G. Deptuch

[2]

SOIPIX collaboration:

- http://rd.kek.jp/project/SOI/

[3]

Current and future 3 dimensional LSI technologies

M. Motoyoshi
,
Kamibayashi
,
M. K. Bonkohara
,
M. Koyonagi